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dc.contributor.authorTurut, A. and Karabulut, A. and Ejderha, K. and Biyikli, N.
dc.date.accessioned2021-04-02T12:03:50Z
dc.date.available2021-04-02T12:03:50Z
dc.date.issued2015
dc.identifier10.1088/2053-1591/2/4/046301
dc.identifier.issn2053-1591
dc.identifier.urihttp://acikerisim.bingol.edu.tr/handle/20.500.12898/2578
dc.description.abstractHigh-k Al2O3 with metallic oxide thickness of about 3 nm on n-type GaAs substrate has been deposited by the atomic layer deposition (ALD) technique. Thus, it has been formed the Au-Ti/Al2O3/n-GaAs MIS structures. It has been seen that the MIS structure exhibits excellent capacitance-voltage (C-V) and current-voltage (I-V) properties at 300 K. The saturation current of the forward bias and reverse bias I-V characteristics was the same value. An ideality factor value of 1.10 has been obtained from the forward bias I-V characteristics. The C-Vcharacteristics of the structure have shown almost no hysteresis from +3 V to -10 V with frequency as a parameter. The reverse bias C-V curves have exhibited a behavior without frequency dispersion and almost hysteresis at each frequency from 10 kHz to 1000 kHz.
dc.language.isoEnglish
dc.sourceMATERIALS RESEARCH EXPRESS
dc.titleCapacitance-conductance characteristics of Au/Ti/Al2O3/n-GaAs structures with very thin Al2O3 interfacial layer
dc.typeArticle


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