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dc.contributor.authorSoylu, M. and Al-Ghamdi, A.A. and Yakuphanoglu, F.
dc.date.accessioned2021-04-08T12:08:29Z
dc.date.available2021-04-08T12:08:29Z
dc.date.issued2016
dc.identifier10.1007/s00339-016-0450-8
dc.identifier.issn09478396
dc.identifier.urihttps://www.scopus.com/inward/record.uri?eid=2-s2.0-84989227545&doi=10.1007%2fs00339-016-0450-8&partnerID=40&md5=108f851ac3baf44a5d1cd87a240c5ef8
dc.identifier.urihttp://acikerisim.bingol.edu.tr/handle/20.500.12898/4615
dc.description.abstractIn this study, an analysis of temperature-dependent electrical characteristics of ZnPc/p-Si structure has been presented. Conduction mechanisms that are accounted for the organic/inorganic devices are evaluated. At low forward voltage, current–voltage (I–V) characteristics show ohmic behavior, limiting extraction of holes from p-Si over the ZnPc/p-Si heterojunction. Thermally activated conduction mechanism appears to be space-charge-limited conduction mechanism, taking into account the presence of an exponential trap distribution with total concentration of traps, Nt of 5.77 × 1025 m−3. The series resistance is found to be temperature dependent. There is a critical point on the regime of series resistance at 200 K. The capacitance varies with temperature at different rates below and above room temperature, indicating a variation in the dielectric constant. © 2016, Springer-Verlag Berlin Heidelberg.
dc.language.isoEnglish
dc.sourceApplied Physics A: Materials Science and Processing
dc.titleThermally activated conductivity of Si hybrid structure based on ZnPc thin film


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